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Numerical Modeling of Droplet Splitting and Merging in a Parallel-Plate Electrowetting-on-Dielectric (EWOD) Device

[+] Author Affiliations
Yin Guan, Albert Y. Tong

University of Texas at Arlington, Arlington, TX

Paper No. MNHMT2013-22152, pp. V001T03A007; 8 pages
doi:10.1115/MNHMT2013-22152
From:
  • ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer
  • ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer
  • Hong Kong, China, December 11–14, 2013
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-3615-4
  • Copyright © 2013 by ASME

abstract

Micro water droplet splitting and merging in a parallel-plate electrowetting-on-dielectric (EWOD) device has been studied numerically. The transient governing equations for the microfluidic flow are solved by a finite volume scheme with a two-step projection method on a fixed computational domain. The interface between liquid and gas is tracked by a coupled Level Set and Volume-of-Fluid (CLSVOF) method. A Continuum Surface Force (CSF) model is employed to model the surface tension at the interface. The physics of the fluid dynamics within the EWOD device has been examined. Contact angle hysteresis, which is an essential component in EWOD, is implemented together with a simplified model for the viscous stresses exerted by the two plates at the solid-liquid interface. The results of the numerical model have been validated with published experimental data. A parametric study has been performed in which the effects of channel height and several other parameters on the fluid motion have been studied.

Copyright © 2013 by ASME

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