0

Full Content is available to subscribers

Subscribe/Learn More  >

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu6Sn5 Intermetallic

[+] Author Affiliations
Soud Farhan Choudhury, Leila Ladani

The University of Alabama, Tuscaloosa, AL

Paper No. IPACK2013-73315, pp. V001T07A020; 6 pages
doi:10.1115/IPACK2013-73315
From:
  • ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
  • Burlingame, California, USA, July 16–18, 2013
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5575-1
  • Copyright © 2013 by ASME

abstract

Solder joints in electronic packages and devices serve as mechanical and electrical connections as well as thermal paths for heat dissipation. Due to the miniaturization of electronic packaging, nowadays solder joints contain large volume fraction of IMCs. It has been observed that solder joint strength is controlled largely by intermetallic strength at higher strain rate. Macroscopic properties such as tensile and shear strength, creep, ductility depend on Intermetallic layer’s properties of solder joints. This study is carried out to determine elastic-plastic properties of Cu6Sn5 intermetallic in Sn-3.5Ag/Cu system with reflow soldering by nanoindentation. Elastic properties such as elastic modulus and hardness were determined from the load-depth curve. A widely used reverse analysis model described by Dao et al. [1] was considered to extract plastic properties such as yield strength and strain hardening exponent using nanoindentation results. Anisotropy of Cu6Sn5 was taken into consideration to see if that has any effect on the mechanical properties. Our study considered crystallographic grain orientation along normal to the growth axis of Cu6Sn5 IMC which was extracted using Electron backscatter diffraction (EBSD) mapping. Statistically indistinguishable properties were observed for Cu6Sn5 IMC. Average elastic-plastic properties of Cu6Sn5 were than compared with already published results in literatures.

Copyright © 2013 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In