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Microstructural Analysis of Low-Cycle Fatigue Damage Process of Sn-Ag-Cu Solder Joint

[+] Author Affiliations
Hiroyuki Kontani, Yoshiharu Kariya, Tomoya Fumikura

Shibaura Institute of Technology, Tokyo, Japan

Paper No. IPACK2013-73192, pp. V001T07A013; 7 pages
doi:10.1115/IPACK2013-73192
From:
  • ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
  • Burlingame, California, USA, July 16–18, 2013
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5575-1
  • Copyright © 2013 by ASME

abstract

In this study, the relationship between microstructural change and fracture in the process of low-cycle fatigue of Sn-Ag-Cu solder joint was investigated using the solder ball of 630μm and 100μm in diameter by analysis of crystallographic orientation by means of EBSD. The 630μm specimen has subgrain boundaries formed by dynamic recovery in the stress concentration region, and the subgrain boundaries become high-angle random grain boundaries by additional cycles. The fatigue crack stably propagates along the random grain boundary in the stress concentration region. In contrast, the 100μm specimen has subgrain boundaries and high-angle random grain boundaries formed across the entire joint area. Since the occurrence of grain boundary fracture across the entire joint area by the connection of high energy grain boundaries, the crack propagation life of the 100μm specimen shortens without the stable crack growth compared to the 630μm specimen.

Copyright © 2013 by ASME

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