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Effect of Electrode Material on Joint Strength of Soldered Joints With Sn-Bi and Sn-Bi-Sb Lead-Free Solder Balls

[+] Author Affiliations
Akihiro Hirata, Ikuo Shohji

Gunma University, Kiryu, Gunma, Japan

Tetsuyuki Tsuchida, Toshikazu Ookubo

Toppan Printing Co., Ltd., Sugito, Saitama, Japan

Paper No. IPACK2013-73171, pp. V001T07A011; 6 pages
doi:10.1115/IPACK2013-73171
From:
  • ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
  • Burlingame, California, USA, July 16–18, 2013
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5575-1
  • Copyright © 2013 by ASME

abstract

The aim of this study is to investigate the joint properties of Sn-58mass%Bi and Sn-57mass%Bi-0.5mass%Sb low-melting lead-free solder balls on the electroless Ni/Au and Ni/Pd/Au plated Cu electrodes fabricated with a lead-free plating solution. Compared with the conventional Ni plating solution containing lead, the soldered joints with Ni/Au and Ni/Pd/Au electrodes fabricated with the lead-free plating solution showed comparable joint properties. In the joints with Ni/Pd/Au electrodes, ball shear force increased when the Pd layer is dissolved into solder by multi reflows. In both joints with Ni/Au and Ni/Pd/Au electrodes, a part of the Ni layer was dissolved into solder and thus the (Ni,Cu)3Sn4 intermetallic compound layer formed at the joint interface. Ball shear force decreased upon aging due to the growth of the (Ni,Cu)3Sn4 layer at the joint interface.

Copyright © 2013 by ASME

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