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Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach

[+] Author Affiliations
Preeti Chauhan, Subhasis Mukherjee, Michael Osterman, Abhijit Dasgupta, Michael Pecht

CALCE, University of Maryland, College Park, MD

Paper No. IPACK2013-73164, pp. V001T07A009; 7 pages
doi:10.1115/IPACK2013-73164
From:
  • ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
  • Burlingame, California, USA, July 16–18, 2013
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5575-1
  • Copyright © 2013 by ASME

abstract

SnAgCu (SAC) solders undergo continuous micro structural coarsening during both storage and service. In this study, we use cross-sectioning and image processing techniques to periodically quantify the effect of isothermal aging quantitatively on phase coarsening and evolution, in SAC305 (Sn3.0Ag0.5Cu) solder. SAC305 alloy is aged for (24–1000) hours at 100°C (∼ 0.7–0.8Tmelt). The characteristic parameters monitored during isothermal aging include size, volume fraction, and inter-particle spacing of both nanoscale Ag3Sn intermetallic compounds (IMCs) and micronscale Cu6Sn5 IMCs, as well as the volume fraction of pure tin dendrites in SAC305 solder.

Effects of above microstructural evolution on secondary creep constitutive response of SAC305 interconnects were modeled using a mechanistic multiscale creep model. The mechanistic phenomena modeled include: (1) dispersion strengthening by coarsened nanoscale Ag3Sn IMCs and reinforcement strengthening by micronscale Cu6Sn5 IMCs, respectively; and (2) load sharing between pure Sn dendrites and the surrounding eutectic Sn-Ag phase.

The coarse-grained polycrystalline Sn micro structure in SAC305 solder was not captured in the above model because isothermal aging did not appear to cause any significant change in the initial grain morphology of SAC305 solder joints. The above model is shown to predict the drop in creep resistance due to the influence of isothermal aging on SAC305 solder joints.

Copyright © 2013 by ASME

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