Full Content is available to subscribers

Subscribe/Learn More  >

Reliability Evaluation of a 3D SIC Package by the Combination of the SEM-DIC and the FEM

[+] Author Affiliations
Toru Ikeda

Kagoshima University, Kagoshima, Japan

Masatoshi Oka, Noriyuki Miyazaki

Kyoto University, Kyoto, Japan

Paper No. IPACK2013-73126, pp. V001T05A003; 7 pages
  • ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
  • Burlingame, California, USA, July 16–18, 2013
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5575-1
  • Copyright © 2013 by ASME


Numerical methods such as the finite element method (FEM) have been used to evaluate the reliability of electronic packages. The accuracy of the analyses should be verified by some experimental measurements. In this study, we evaluated the thermal strain of a test chip for three-dimensional stacked integrated circuits (3D SIC) with both measurement and an analysis. First, the distribution of thermal strain on the cross-section of a test chip was measured using scanning electron microscope (SEM) and the digital image correlation. Then, the distribution of strain of the test chip was also analyzed by the FEM considering the viscoelastic material properties of underfill (UF) resin measured with the stress relaxation test and the elastic-plastic material properties of components measured with the nano-indentation tests. The accuracy of the nonlinear finite element analysis was verified using the strain measurements with the SEM-DICM.

A test specimen for the 3D SIC packages was built and cut out a part of the test specimen and polished its cross-section. We took digital images using a SEM (FEI Quanta 200) to measure the strain distributions on the cross-section of a specimen by the DICM. The specimen was subjected to thermal loading in a heat chamber. The temperature in the chamber was raised from 30° C to 130°C.

The FE analyses were carried out using MSC.Marc™. We assumed the initial temperature of the analysis to be 150°C, which was the curing temperature of the UF resin, and decreased the temperature to 30°C during 100 seconds. Then, the temperature was raised up to 130°C, which is the same with the experiment. We compared the numerical result with the measurement and modified the model of the FE analyses.

Copyright © 2013 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In