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A Study on Impact Stresses in Ceramic Capacitors

[+] Author Affiliations
Takashi Kawakami, Noriyo Horikawa, Takahiro Kinoshita, Tomohiro Inagaki

Toyama Prefectural University, Toyama, Japan

Paper No. IPACK2013-73191, pp. V001T04A013; 4 pages
doi:10.1115/IPACK2013-73191
From:
  • ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
  • Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes
  • Burlingame, California, USA, July 16–18, 2013
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 978-0-7918-5575-1
  • Copyright © 2013 by ASME

abstract

Multilayer ceramic capacitors (MLCCs) are used very widely as electric devices on printed circuit boards (PCBs). Impact loads are applied on MLCCs during PCB manufacturing processes with fast mounting machines or floor dropping of mobile appliances and MLCCs may crack sometime due to the mechanical design. In this paper, impact stresses, which were induced in MLCCs by split Hopkinson bar impact tests, were analyzed with large scale parallel computing method.

Copyright © 2013 by ASME
Topics: Ceramics , Stress

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