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Compact Model Based Microfluidic Controller for Energy Efficient Thermal Management Using Pin-Fin Enhanced Micro Gap

[+] Author Affiliations
Xuefei Han, Yogendra Joshi

Georgia Institute of Technology, Atlanta, GA

Paper No. HT2013-17474, pp. V003T10A008; 9 pages
  • ASME 2013 Heat Transfer Summer Conference collocated with the ASME 2013 7th International Conference on Energy Sustainability and the ASME 2013 11th International Conference on Fuel Cell Science, Engineering and Technology
  • Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles
  • Minneapolis, Minnesota, USA, July 14–19, 2013
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-5549-2
  • Copyright © 2013 by ASME


Over-cooling of electronic devices and systems results in excess energy consumption, which can be reduced by closely linking cooling requirements with actual power dissipation. A thermal model-based flow rate controller for single phase liquid cooled three-dimensional (3D) stacked chips, using pin-fin enhanced micro gap was studied in this paper. A thermal compact model of a two-layer pin fin enhanced micro gap was developed, which ran 105 times faster than using full-field computational fluid dynamics/heat transfer (CFD/HT) method, with reasonable accuracy and spatial details. This was used in conjunction with a flow rate control strategy to provide the needed amount of liquid to cool the heat sources to the desired temperature range. An example case study shows that the estimated energy savings in pump power is about 27% compared with pumping fluid at a constant flow rate.

Copyright © 2013 by ASME



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