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Thermal Shock Effects on Dynamic Deformation Mechanisms in Ti2AlC

[+] Author Affiliations
R. Bhattacharya, N. C. Goulbourne

University of Michigan, Ann Arbor, MI

Paper No. IMECE2012-88040, pp. 165-185; 21 pages
  • ASME 2012 International Mechanical Engineering Congress and Exposition
  • Volume 1: Advances in Aerospace Technology
  • Houston, Texas, USA, November 9–15, 2012
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4517-2
  • Copyright © 2012 by ASME


The present study is aimed at understanding the effects of thermal shock and associated microstructural features on the dynamic deformation mechanisms in Ti2AlC, a Mn+1AXn phase ternary ceramic. These materials crystallize in a Hexagonal Close Packed (HCP) structure with a c/a ratio greater than 1.67 which results in kink band formations when subjected to loading. In this work, we report the microstructural changes associated with thermal shocking of Mn+1AXn phases and its effects on deformation mechanisms, under dynamic compressive loading. The specimens are heated to temperatures of 220, 550 and 900°C, held at each temperature for 5–10 minutes, and subsequently quenched in water at 20°C to induce thermal shock. The thermal shock resistance and its effect on mechanical properties is investigated by subjecting heat treated specimens to compressive loading at high strain rates (∼1000–4500 s−1) using a Split Hopkinson Pressure Bar (SHPB). The microstructures of thermally shocked specimens are characterized by Scanning Electron Microscopy (SEM) combined with Energy Dispersive Spectroscopy (EDS) analysis to reveal the surface morphologies and characteristics. The displacements during the deformation events are captured using in situ high speed imaging, with full-field 2D Digital Image Correlation (DIC) technique. The key microscale mechanisms of deformation are studied using SEM analysis of deformed/fractured specimens.

Copyright © 2012 by ASME



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