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Analysis on the Temperature Rise Produced by Plastic Deformation Heat for Nanoscale Orthogonal Cutting of Copper Workpiece

[+] Author Affiliations
Zone-Ching Lin, Ying-Chih Hsu, Liang-Kuang Chen

National Taiwan University of Science and Technology, Taipei, Taiwan

Paper No. ESDA2012-82121, pp. 423-429; 7 pages
  • ASME 2012 11th Biennial Conference on Engineering Systems Design and Analysis
  • Volume 1: Advanced Computational Mechanics; Advanced Simulation-Based Engineering Sciences; Virtual and Augmented Reality; Applied Solid Mechanics and Material Processing; Dynamical Systems and Control
  • Nantes, France, July 2–4, 2012
  • Conference Sponsors: International
  • ISBN: 978-0-7918-4484-7
  • Copyright © 2012 by ASME


The quasi-steady molecular statics nanoscale orthogonal cutting model developed by this paper not only can calculate cutting force, equivalent stress and equivalent strain, but also can calculate the temperature rise of the cut perfect crystal copper workpiece. This paper considers that during nanoscale orthogonal cutting, the temperature rise of the cut perfect crystal copper workpiece is produced by plastic deformation heat only. The calculation method of equivalent stress and equivalent strain uses three-dimensional quasi-steady molecular statics nanocutting model to calculate and simulate the phenomenon. The model for plastic deformation heat developed by this paper can be used to calculate the equivalent stress and equivalent strain of the cut copper workpiece. Furthermore, the calculation method of temperature rise of the cut workpiece produced by plastic deformation heat is developed. Afterwards the analysis of temperature distribution is also conducted. And the obtained temperature distribution of the cut copper workpiece computed by this paper is qualitatively compared with the temperature distribution obtained by molecular dynamics method in the reference.

Copyright © 2012 by ASME



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