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Study on the Frequency Response Characteristics of Thermal Stress Induced by Multidimensional Fluid Temperature Fluctuation

[+] Author Affiliations
Cristian Santiago Perez T.

Worley Parsons, ANZ, Brisbane, AustraliaThe University of Tokyo, Tokyo, Japan

Naoto Kasahara

The University of Tokyo, Tokyo, Japan

Paper No. PVP2012-78126, pp. 843-852; 10 pages
doi:10.1115/PVP2012-78126
From:
  • ASME 2012 Pressure Vessels and Piping Conference
  • Volume 3: Design and Analysis
  • Toronto, Ontario, Canada, July 15–19, 2012
  • Conference Sponsors: Pressure Vessels and Piping Division
  • ISBN: 978-0-7918-5502-7
  • Copyright © 2012 by ASME

abstract

A simplified one dimensional approach for predicting the thermal stress in structures subject to near wall fluid temperature fluctuations has been previously developed and published by the author Kasahara. The method predicted the thermal stress by calculating the frequency response, formulated by the product of the effective heat transfer and the effective thermal stress related to one-dimensional temperature gradient developed through the wall thickness of the structure. Although, currently adopted by the Japanese Society of Mechanical Engineers (JSME) guideline for calculating the thermal fatigue damage in structures, recent studies have highlighted the limitations of the one dimensional approach by showing the presences of multidimensional fluid temperature fluctuation in plane direction, increasing the need to extend the current analysis to more detailed multidimensional guideline.

The aim of this research is to advance the theoretical knowledge and understanding of complex multidimensional phenomenon related to local thermal fluctuations within small localized area at the surface of the structure, referred to as “Hot Spot” which is observed to have important effects on the thermal stress phenomenon. Furthermore, the understanding of heat transfer processes in the structure, especially heat diffusion that is known to produce a thermal gradient and, therefore, thermal stress. Understanding the behavior of each heat transfer process in the Hot Spot and the relationship to the response in frequency has formed the bases for extending the current one-dimensional model.

This paper presents the analytical results of the study and proposes an extended multidimensional model to understand the thermal stress in tee-junction due to fluid temperature fluctuation and the close relation with the frequency. The model is derived from the understanding of the phenomenon which has leaded to quantify the effect by introducing certain multidimensional factors to explain the impact of the multidimensional fluid temperature fluctuation.

Copyright © 2012 by ASME

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