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A Monolithic Micro Four-Bar Mechanism With Flexure Hinges

[+] Author Affiliations
Sang-Joon John Lee, Raymond K. Yee, Reginald Kelley, Roy Martin, Alain Sadaka, Tai-Ran Hsu

San José State University

Paper No. IMECE2004-62263, pp. 345-350; 6 pages
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Microelectromechanical Systems
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Microelectromechanical Systems Division
  • ISBN: 0-7918-4714-4 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME


A monolithic micro four-bar mechanism was fabricated in silicon to examine motion amplification as well as the effect of non-ideal geometric profiles in its flexure hinges. Through-wafer deep reactive ion etching (DRIE) was used to produce high-aspect-ratio flexure joints that allow compliant motion within the plane of a silicon wafer. The flexures were approximately 20 microns wide and 530 microns deep, micromachined through the entire wafer thickness. A taper angle of approximately 0.5 degree narrowing toward the bottom of the wafer was measured in the flexure cross section. A finite element model was developed to predict the output rotation of one link in response to the displacement applied at the drive link. For a 1-micron linear input, the model predicted a 0.39-degree angular displacement for the output link. This showed close agreement with experimental data that measured 0.41 degree. An enhanced finite element model that accounted for the tapered cross-section, however, predicted a slightly smaller input/output relation of 0.37 degree per micron.

Copyright © 2004 by ASME



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