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Mechanical Behavior of Electrodeposited Copper Film at Elevated Temperatures

[+] Author Affiliations
D. T. Read, Y.-W. Cheng, R. Geiss

National Institute of Standards and Technology

Paper No. IMECE2004-61320, pp. 113-116; 4 pages
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Materials
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Materials Division
  • ISBN: 0-7918-4712-8 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME


The temperature dependence of the strength of a thin copper electrodeposit has been measured, by microtensile testing, from room temperature to 150 °C. The ultimate tensile strength decreased from around 240 MPa at room temperature to just above 200 MPa at 150 °C. The yield strength followed a similar trend. Elongation to failure increased slightly with temperature. The Young’s modulus, as measured by the unload-load slope, was well below the values expected based on averaging single-crystal elastic constants at all test temperatures. The effect of strain rate on strength at room temperature, using a range of over a decade, was low, with a weak trend upward.

Copyright © 2004 by ASME



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