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Stress Assisted Controlled Fabrication of Nano Channels and Their Flow Characteristics

[+] Author Affiliations
Sathyanarayanan Mani, Taher M. Saif

University of Illinois at Urbana-Champaign

Paper No. IMECE2004-60972, pp. 565-569; 5 pages
doi:10.1115/IMECE2004-60972
From:
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME

abstract

A method to fabricate nano channels narrower than 50nm without the need for any nano lithography is presented. The nano channels are formed by cracking a thin film of silicon dioxide on a silicon substrate by residual stress alone. However, for controlled initiation of cracks on oxide, stress raisers are planted on a silicon substrate by deep RIE. These channels are used to study capillary driven fluid flow through nanochannels. Experimental analysis suggests that the flow rate is inversely proportional to the square root of time, which is in agreement with the theoretical model. From the theoretical plot that fits the experimental data the value of the proportionality constant is determined. From this value it is possible to back calculate the meniscus contact angle if we know the surface energy of the fluid or vice versa.

Copyright © 2004 by ASME

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