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Impact Test and Simulation of Portable Electronic Devices: An Assessment

[+] Author Affiliations
Sheng Liu, Xin Wu, Ronald Gibson

Wayne State University

Xuefang Wang, Hong Hai Zhang, Zhiyin Gan, Jianwen Ren

Huazhong University of Science and Technology

Bin Chen

Wisdom Technology, Inc.

Paper No. IMECE2004-62506, pp. 451-459; 9 pages
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME


Portable electronics devices are well known to be susceptible to drop impact which can cause various damage modes such as interconnect breakage, battery separation, possible cracking/debonding along interfaces, display damage, leaking in insulin pump, etc., Drop/impact performance of these products is one of important concerns of product design. Because of the small size of this type of electronics products, it is very expensive, time-consuming and difficult to conduct drop tests to directly detect the failure mechanisms and identify their drop behaviors. A brief review is given in terms of the development in testing standards, material modeling and structure modeling. Barriers and needs are given for both the measurement and modeling, with particular attention to the material rate dependent constitutive modeling, testing facilities development, and nonlinear contact mechanics modeling.

Copyright © 2004 by ASME



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