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Analytical Solution for BGA Modules Under Thermal/Mechanical Loading

[+] Author Affiliations
Zhengfang Qian, Joe Tomase

Motorola, Inc.

Paper No. IMECE2004-62073, pp. 417-423; 7 pages
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME


This paper presents an advanced approach to obtain analytical solutions for BGA-type package or module under both thermal loading and mechanical bending. The theoretical framework is based on two-dimensional theory of plate pure bending. Solder joint shear strain distribution has been derived analytically. Specifically, the joint strain has been correlated with measured board strain. The approach developed and analytical solutions obtained are very useful for rapid component qualification in terms of solder joint reliability.

Copyright © 2004 by ASME



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