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Rapid Prediction of BGA Board Level Reliability Due to PWB Flexure

[+] Author Affiliations
Chuntao Zhang

Motorola, Inc.

Paper No. IMECE2004-61172, pp. 399-406; 8 pages
doi:10.1115/IMECE2004-61172
From:
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME

abstract

BGA interconnect fatigue failure due to printed wiring board (PWB) flexure has been one of the top board-level reliability issues in portable electronic devices as products become smaller and lighter. Although much effort has been expended in the past to investigate the effect of package design on component bending reliability, the effects of PWB structural parameters such as board support and component location on board-level reliability have not been well studied. As a result, data and information currently available for design assistance are limited. In this study, a methodology was developed to systematically characterize the component board level reliability due to PWB flexure. Response surfaces and correction factors were generated based on the systematic characterization with respect to the board structural parameters and other influential factors, and implemented in a software tool, permitting rapid reliability prediction of BGA board level reliability at the earliest stage of product development process to reduce cycle time.

Copyright © 2004 by ASME

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