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Guideline for the Dropping Test of the Impact Reliability Study of Solder Joints

[+] Author Affiliations
Qiang Yu, Keiji Watanabe, Toshihiro Tsurusawa, Masaki Shiratori

Yokohama National University

Manabu Kakino, Noriyuki Fujiwara

Matsushita Electric Industrial Company, Ltd.

Paper No. IMECE2004-61096, pp. 393-398; 6 pages
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME


As a result of the miniaturization of mobile electronic devices in recent years, assessing the drop impact reliability of solder joints has become increasingly important. The purpose of the present paper is to establish an experimental method by which to determine the drop impact reliability of solder joint. The drop impact problem consists of various factors, including impact-induced flexural vibration of PCB, collision attitude, and dynamic fracture of solder joints. Numerous methods have been developed for examining the impact reliability of BGA solder joints. Among these is a repeated drop test proposed by the present authors that uses a simple apparatus. The effects of the drop angle on the dynamic behavior of PCB were discussed. In a previous report, it was confirmed that even if the collision angle is very small, the dynamic deformation of the PCB is greatly affected by the collision angle. In this study, the dynamic behavior was dramatically improved by attaching a hemisphere to the bottom of the holder, and the result was equivalent to stable dynamic deformation of the PCB in horizontal collisions. In addition, the relationship between drop height and cycle to failure of the CSP was obtained. The authors also investigated the interaction of the vibration modes of PCB and the specimen holder and the relationship between the holder geometry and its impact strength. Finally, through repeated drop testing, a holder geometry was obtained that did not adversely affect the PCB upon impact.

Copyright © 2004 by ASME



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