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Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

[+] Author Affiliations
John Lau

Agilent Technologies, Inc.

Ricky Lee

HKUS&T

Dongkai Shangguan

Flextronics

Paper No. IMECE2004-62493, pp. 265-270; 6 pages
doi:10.1115/IMECE2004-62493
From:
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME

abstract

Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package assembly is predicted and discussed.

Copyright © 2004 by ASME

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