Full Content is available to subscribers

Subscribe/Learn More  >

Effects of Dwell-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints

[+] Author Affiliations
John Lau, Walter Dauksher

Agilent Technologies, Inc.

Paper No. IMECE2004-62492, pp. 257-263; 7 pages
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME


The effects of temperature-cycling dwell-time on the thermal-fatigue life of lead-free solder joints are investigated in this study. Emphasis is placed on the determination of creep responses and the creep strain energy density per cycle of a PBGA (plastic ball grid array) package’s lead-free solder joints subjected to various dwell times (namely, 15, 60, and 480 minutes) at peak cycling temperatures (0°C and 100°C).

Copyright © 2004 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In