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Testing the Die Attach Quality of 3D Stacked Dies

[+] Author Affiliations
M. Rencz, A. Poppe

MicReD Ltd.

V. Székely

BUTE

B. Courtois

TIMA Laboratory

L. Zhang, N. Howard, L. Nguyen

National Semiconductor Corporation

Paper No. IMECE2004-62418, pp. 249-256; 8 pages
doi:10.1115/IMECE2004-62418
From:
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME

abstract

The paper presents the structure function based methodologies for testing the die attach quality of packages containing stacked dies. After the presentation of the theoretical background several measured test series are presented to demonstrate the use and the advantages of the method. The method is applicable for the fast diagnosis of the die-attach problems of stacked dies, and it does not require any additional circuit elements in any of the stacked dies.

Copyright © 2004 by ASME
Topics: Testing

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