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Stochastic Characterization of Epoxies to Predict Performance Uncertainty of Photonic Packages

[+] Author Affiliations
S. Radhakrishnan, G. Subbarayan

Purdue University

L. Nguyen, W. Mazotti

National Semiconductor Corporation

Paper No. IMECE2004-61846, pp. 211-218; 8 pages
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME


There is considerable uncertainty in the prediction of performance of a system mainly due to idealizations in geometry, material behavior, and loading history. Uncertainties in geometry can be predicted and controlled using tighter tolerances. However, the models currently used to describe material behavior are mostly deterministic. To predict the coupling efficiency of a photonic system to greater degree of confidence, stochastic analysis procedures are necessary. As part of this analysis, the behavior of materials must be stochastically characterized. In this paper, we present extensive experimental data on thermally and UV-cured epoxies typically used in photonic packages to enable stochastic analysis. The test data includes the viscoelastic behavior. We present analytical model to obtain the variation in the displacement of the epoxies resulting from its stochastic viscoelastic behavior. We utilize the analytical model to predict the uncertainty in the coupling efficiency of a generic photonic package.

Copyright © 2004 by ASME



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