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Modeling the Behavior of Insertion-Mounted Components — Part 1

[+] Author Affiliations
Ricky Valentin, Donald Barker, Aaron Johnson

University of Maryland

Paper No. IMECE2004-61713, pp. 197-209; 13 pages
doi:10.1115/IMECE2004-61713
From:
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME

abstract

Insertion mount, or trough hole, technology has historically been considered a fatigue-free method for soldering components to printed circuit boards; recently, though, applications implementing this technology have experienced use lifetimes sufficient to warrant investigation into fatigue failure. Although much research has been done into failure mechanisms and rapid failure prediction methods for surface mount components, there have been on such studies in the area of insertion mount technology. Therefore, this paper will be the first in a series of two papers introducing a rapid failure assessment approach for components fixed using insertion mount technology. The purpose of this paper will be to introduce the methodology used in this study, as well as to provide a method for determining the critical lead forces quickly and accurately.

Copyright © 2004 by ASME

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