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Issues in Assembly Process of Fine Pitch Chip-on-Flex Packages for LCD Applications

[+] Author Affiliations
Changsoo Jang, Seongyoung Han, Jay Ryu, Hangyu Kim

Samsung Techwin Company, Ltd.

Paper No. IMECE2004-59155, pp. 131-138; 8 pages
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME


Some of the current assembly issues of fine pitch chip-on-flex (COF) packages for LCD applications are reviewed. Traditional underfill material, anisotropic conductive adhesive (ACA) and non-conductive adhesive (NCA) are considered in conjunction with two applicable bonding methods including thermal and laser bonding. Advantages and disadvantages of each material/process combination are identified. Their applicability is further investigated to identify a process most suitable to the fine pitch packages (less than 40 μm). Numerical results and subsequent testing results indicate that NCA/laser bonding process produces most reliable joint for the fine pitch packages.

Copyright © 2004 by ASME
Topics: Manufacturing



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