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Validation of Analytical Methods for Parallel Plate Fin Heat Sinks

[+] Author Affiliations
Guoping Xu, Henry Jung

Sun Microsystems, Inc.

Paper No. IMECE2004-59811, pp. 23-28; 6 pages
doi:10.1115/IMECE2004-59811
From:
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4707-1 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME

abstract

Several analytical models to predict heat transfer and pressure drop performance for parallel plate fin heat sinks are available in the literature. However, the experimental data to validate these models are very limited especially for high fin density heat sinks. In this paper, a new method is proposed to predict thermal performance in both laminar flow and turbulent flow. This method and other models selected from the literature have been compared to the test data. Experimental investigations were conducted with fully-duct flow for parallel plate fin heat sinks to measure overall thermal resistance and pressure drop. Three heat sinks with different fin materials and fin configurations are tested. We conclude by recommending some of the analytical methods for engineering applications by comparing the test data with predictions.

Copyright © 2004 by ASME

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