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Effect of Mechanical and Thermal Cycling on Shape Memory Properties of High Temperature Cu-Al-Ni Single Crystals

[+] Author Affiliations
Ganesh K. Kannarpady, A. Bhattacharyya

University of Arkansas at Little Rock

Paper No. IMECE2004-62289, pp. 281-285; 5 pages
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Aerospace
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Aerospace Division
  • ISBN: 0-7918-4700-4 | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME


With a view towards applications as actuators, the effect of mechanical cycling followed by thermal cycling on 1.5 mm diameter Cu-13.3%Al-4%Ni (by weight) single crystal wires with high stress-free transformation temperatures: Mf = 96°C, Ms = 105.5°C, As = 111.6°C and Af = 115.8°C (determined by the method of tangents) have been studied at different ambient temperatures in the range 25–125°C. The tests are carried out in an Instron machine with an environmental chamber. Stress cycling at a given ambient temperature was carried out for an overall strain of 9% until the stress-strain curves became fairly repeatable. A total of 35 stress cycles were needed to span the ambient temperature range, 25–125°C. The material showed an excellent retention of the shape memory effect in the range of 25–100°C (this is below the Af = 115.8°C of the as-received sample), excellent pseudoelasticity at 125°C, and no irreversible plastic deformation. A net downward shift of transformation temperatures by about 5°C did occur over the first 11 cycles. This was followed by a reversal of the downward shift and the transformation temperatures stabilized by the 35th cycle close to those of the as-received sample. The stabilized temperatures were: Mf = 95°C, Ms = 106.5°C, As = 110°C and Af = 118.5°C (method of tangents). However, the transformation occurred over a wider temperature range as compared to that of the as-received sample, especially during the austenite to martensite transformation on cooling. These features point to the possibility of the Cu-13.3%Al-4%Ni single crystal as a highly competitive candidate for actuator applications.

Copyright © 2004 by ASME



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