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Measured Performance of a Micro Thermoelectric Cooler

[+] Author Affiliations
Luciana W. da Silva, Massoud Kaviany

University of Michigan, Ann Arbor, MI

Mehdi Asheghi

Carnegie Mellon University, Pittsburgh, PA

Paper No. HT-FED2004-56412, pp. 415-422; 8 pages
doi:10.1115/HT-FED2004-56412
From:
  • ASME 2004 Heat Transfer/Fluids Engineering Summer Conference
  • Volume 4
  • Charlotte, North Carolina, USA, July 11–15, 2004
  • Conference Sponsors: Heat Transfer Division and Fluids Engineering Division
  • ISBN: 0-7918-4693-8 | eISBN: 0-7918-3740-8
  • Copyright © 2004 by ASME

abstract

The measured performance of a column-type micro thermoelectric cooler, fabricated using vapor deposited thermoelectric films and patterned using photolithography processes, is reported. The columns, made of p-type Sb2 Te3 and n-type Bi2 Te3 with an average thickness of 4.5 μm, are connected using Cr/Au/Ti/Pt layers at the hot junctions, and Cr/Au layers at the cold junctions. The measured Seebeck coefficient and electrical resistivity of the thermoelectric films, which were deposited with a substrate temperature of 130°C, are −74 μV/K and 3.6×10−5 Ω-m (n-type), and 97 μV/K and 3.1×10−5 Ω-m (p-type). The cooling performance of devices with 60 thermoelectric pairs and a column width of 40 μm is evaluated under a minimal cooling load (thermobuoyant surface convection and surface radiation). The temperatures of the cold and hot surfaces are obtained with an infrared camera. The average cooling achieved is about 1 K. The measured overall electrical resistance ranges from 51 to 58 Ω. Current challenges include the reduction of the column width, implementation of higher substrate temperatures for optimum thermoelectric properties, and improvements of the top connector fabrication.

Copyright © 2004 by ASME

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