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Experimental Thermal Behavior of Electronic Chips in a Channel During Pump-On Transient Period

[+] Author Affiliations
H. Bhowmik, K. W. Tou, C. P. Tso

Nanyang Technological University, Singapore

Paper No. HT-FED2004-56287, pp. 377-380; 4 pages
doi:10.1115/HT-FED2004-56287
From:
  • ASME 2004 Heat Transfer/Fluids Engineering Summer Conference
  • Volume 4
  • Charlotte, North Carolina, USA, July 11–15, 2004
  • Conference Sponsors: Heat Transfer Division and Fluids Engineering Division
  • ISBN: 0-7918-4693-8 | eISBN: 0-7918-3740-8
  • Copyright © 2004 by ASME

abstract

Experiments are performed to study the heat transfer characteristics during the pump-on transient period from an array of 4 × 1 flush mounted discrete heat sources in a vertical rectangular channel using water as the working fluid. The experimental data covers the flow regime with Reynolds number based on heat source length ranging from 1050 to 2625. The applied uniform heat fluxes to the chips are 1, 3, 5 and 7 W/cm2 . The effects of heat flux, flow rates and chip numbers are investigated and empirical correlations are developed for investigated and empirical correlations are developed for individual chips as well as for overall data in the transient regime. The transient correlation recommended is Nul /(Pel )1/3 = 3.5(Fo)1/4 .

Copyright © 2004 by ASME

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