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Air Cooling Study of Transient Natural Convection Heat Transfer From Simulated Electronic Chips

[+] Author Affiliations
H. Bhowmik, K. W. Tou

Nanyang Technological University

Paper No. IMECE2004-59503, pp. 47-51; 5 pages
doi:10.1115/IMECE2004-59503
From:
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 3
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4711-X | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME

abstract

Experiments are performed to study the heat transfer characteristics during the power-on transient period from an array of 4 × 1 discrete heat sources in a vertical rectangular channel using air as the working fluid. The heat flux ranges from 1000 W/m2 to 5000 W/m2 . For 2 mm protrusion of the heater, the effect of heat fluxes and chip numbers are investigated and observed that the transient Nul strongly depends on the number of chips. Correlations are presented for individual chips as well as for overall data in the transient regime.

Copyright © 2004 by ASME

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