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Pool Boiling Heat Transfer From Artificial Micro-Cavities Surface in Dielectric Liquid FC-72

[+] Author Affiliations
C. K. Yu, D. C. Lu

National Chiao Tung University

T. C. Cheng

National Nano Device Laboratory

B. C. Tsai

Industrial Technology Research Institute

Paper No. IMECE2004-59297, pp. 21-25; 5 pages
doi:10.1115/IMECE2004-59297
From:
  • ASME 2004 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 3
  • Anaheim, California, USA, November 13 – 19, 2004
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4711-X | eISBN: 0-7918-4178-2, 0-7918-4179-0, 0-7918-4180-4
  • Copyright © 2004 by ASME

abstract

Pool boiling heat transfer phenomenon of artificial micro-cavity enhanced surfaces by wet etching MEMS fabrication immersed in a saturated dielectric fluid has been experimentally studied. The present research is to investigate pool boiling behavior including heat transfer performance and flow pattern of “artificial micro cavities” heating surfaces simulating microelectronic devices at atmospheric pressure with FC-72 as the working fluid. The test surfaces are the solid silicon based blocks with 200 μm diameter circular cavities with flat plane, 16 × 16, 25 × 25, 33 × 33 array and 50 μm depth. Effects of this double enhancement technique on critical heat flux (CHF) and nucleate boiling heat transfer in the horizontal orientation (microcavities are vertical) were also investigated. Results indicated that, in general, increasing the number of micro cavities also increase the enhanced surface area and it could increase the critical heat flux. The pronounced increase of boiling heat transfer coefficients with the application of the artificial micro-cavity to the heat surface were also investigated in this paper.

Copyright © 2004 by ASME

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