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A New Conduction Heat Transfer Technology

[+] Author Affiliations
Victor J. N. Dilloway

Consultant to QuEnergy International, San Diego, CA

Paper No. HT-FED2004-56489, pp. 341-343; 3 pages
doi:10.1115/HT-FED2004-56489
From:
  • ASME 2004 Heat Transfer/Fluids Engineering Summer Conference
  • Volume 1
  • Charlotte, North Carolina, USA, July 11–15, 2004
  • Conference Sponsors: Heat Transfer Division and Fluids Engineering Division
  • ISBN: 0-7918-4690-3 | eISBN: 0-7918-3740-8
  • Copyright © 2004 by ASME

abstract

This paper describes a new conductive heat transfer technology that has been developed to the point of commercial application in China. Although the technology, QuTech™, was granted a U. S. Patent on October 17, 2000, only one North American commercial applications exist at this time. This technology imparts extremely high thermal conductivity to a tube or pipe. It functions similar to a heat pipe except that there is no internal liquid to vaporize and condense for transportation of thermal energy from one point to another along the pipe. The technology is typically used to transfer thermal energy from one side of a barrier to another. The barrier may be the wall of a pressure vessel or a “divider plate” between flowing media.

Copyright © 2004 by ASME

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