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Damping Enhancement in Printed Circuit Boards With Potting Materials or Microfibrous Metallic Cloth

[+] Author Affiliations
Nesha Hyatt, Meagan Black, Robert Dean, George Flowers

Auburn University, Auburn, AL

Brian Grantham, Russ Garner

U.S. Army AMRDEC, Huntsville, AL

Paper No. DETC2009-87846, pp. 805-810; 6 pages
doi:10.1115/DETC2009-87846
From:
  • ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
  • Volume 1: 22nd Biennial Conference on Mechanical Vibration and Noise, Parts A and B
  • San Diego, California, USA, August 30–September 2, 2009
  • Conference Sponsors: Design Engineering Division and Computers in Engineering Division
  • ISBN: 978-0-7918-4898-2 | eISBN: 978-0-7918-3856-3
  • Copyright © 2009 by ASME

abstract

As a result of the relatively low intrinsic damping in printed circuit boards, vibration and shock loading may excite vibration modes that lead to vibration-induced damage of the PCB and attached components. An investigation of techniques to enhance the damping in printed circuit boards is conducted. Experimental evaluation of the effects of several damping treatments was performed. Of particular interest were the effects of potting materials and microfibrous metallic cloth sandwich configurations. The results from different configurations for each type of treatment are compared and the results discussed. An overall summary of the results is presented and conclusions/observations are discussed.

Copyright © 2009 by ASME

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