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A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers

[+] Author Affiliations
Jeremiah N. Mpagazehe, Geo A. Thukalil, C. Fred Higgs, III

Carnegie Mellon University, Pittsburgh, PA

Paper No. IJTC2009-15205, pp. 27-29; 3 pages
doi:10.1115/IJTC2009-15205
From:
  • ASME/STLE 2009 International Joint Tribology Conference
  • ASME/STLE 2009 International Joint Tribology Conference
  • Memphis, Tennessee, USA, October 19–21, 2009
  • Conference Sponsors: Tribology Division
  • ISBN: 978-0-7918-4895-1 | eISBN: 978-0-7918-3862-4
  • Copyright © 2009 by ASME

abstract

The prediction of dishing and erosion caused by CMP is desired as they adversely affect the electrical properties of interconnects in integrated circuits. For a model to properly capture these phenomena, it must account for the time dependent surface evolution in CMP. This work employs the previously introduced Particle-Augmented Mixed Lubrication (PAML) model to predict dishing and erosion in CMP. By using PAML to model the polishing of a patterned wafer, it is possible to predict the dishing and erosion experienced during CMP.

Copyright © 2009 by ASME

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