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Stress Analysis of a Elastic Cracked Layer Bonded to a Viscoelastic Substrate

[+] Author Affiliations
C. K. Chao, C. C. Hsiao

National Taiwan University of Science and Technology, Taipei, Taiwan, R.O.C.

Paper No. PVP2004-2299, pp. 37-46; 10 pages
  • ASME/JSME 2004 Pressure Vessels and Piping Conference
  • Fracture Methodologies and Manufacturing Processes
  • San Diego, California, USA, July 25–29, 2004
  • Conference Sponsors: Pressure Vessels and Piping Division
  • ISBN: 0-7918-4669-5
  • Copyright © 2004 by ASME


The effect of a viscoelastic substrate on an elastic cracked layer under an in-plane concentrated load is solved and discussed in this study. Based on a correspondence principle, the viscoelastic solution is directly obtained from the corresponding elastic one. The elastic solution in an anisotropic trimaterial is solved as a rapidly convergent series in terms of complex potentials via the successive iterations of the alternating technique in order to satisfy the continuity condition along the interfaces between dissimilar media. This trimaterial solution is then applied to a problem of a thin layer bonded to a half-plane substrate. Using the standard solid model to formulate the viscoelastic constitutive equation, the real time stress intensity factors can be directly obtained by performing the numerical calculations. The results obtained in this paper are useful in studying the problem with defects where a crack is assumed to exist in an elastic body that is bonded to a viscoelastic substrate.

Copyright © 2004 by ASME



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