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Threshold Stress for Crack-Healing of Silicon Nitride Ceramics

[+] Author Affiliations
Koji Takahashi, Kotoji Ando, Shoko Yoshida

Yokohama National University, Japan

Shinji Saito

NHK Spring Company, Ltd., Yokohama, Japan

Paper No. PVP2004-2992, pp. 195-200; 6 pages
  • ASME/JSME 2004 Pressure Vessels and Piping Conference
  • Elevated Temperature Design and Analysis, Nonlinear Analysis, and Plastic Components
  • San Diego, California, USA, July 25–29, 2004
  • Conference Sponsors: Pressure Vessels and Piping Division
  • ISBN: 0-7918-4667-9
  • Copyright © 2004 by ASME


Si3 N4 /SiC composite ceramics were hot-pressed in order to investigate the crack-healing behavior under stress. Semi-elliptical surface cracks of 100 μm in surface length were introduced on each specimen. The pre-cracked specimens were crack-healed under cyclic or constant bending stress of 5 Hz at healing temperatures of 1000° and 1200°C and the resultant bending strength and fatigue strength were studied. The threshold stress for crack-healing, below which the pre-cracked specimens recovered their bending strength, was investigated. The mechanisms of crack-healing in Si3 N4 /SiC under stress were also discussed.

Copyright © 2004 by ASME



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