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TiAl Intermetallics for Aerospace Applications: Fracture Resistance and Cracking Mechanisms

[+] Author Affiliations
Amar N. Kumar, Amiya Nayak, Alka Srivastava

Tecsis Corporation, Ottawa, ON, Canada

Udit K. Roy

Carleton University, Ottawa, ON, Canada

Prakash C. Patnaik

IAR - NRC, Ottawa, ON, Canada

Paper No. GT2009-59566, pp. 839-848; 10 pages
doi:10.1115/GT2009-59566
From:
  • ASME Turbo Expo 2009: Power for Land, Sea, and Air
  • Volume 4: Cycle Innovations; Industrial and Cogeneration; Manufacturing Materials and Metallurgy; Marine
  • Orlando, Florida, USA, June 8–12, 2009
  • Conference Sponsors: International Gas Turbine Institute
  • ISBN: 978-0-7918-4885-2 | eISBN: 978-0-7918-3849-5
  • Copyright © 2009 by ASME

abstract

Research on TiAl aluminides has been undertaken to further advance the understanding of deformation and fracture mechanisms, vis-à-vis the heat treatment effects on microstructure, fracture resistance and cracking mechanisms. Two TiAl grades considered comprise of Al-Nb-Mn-Cr-Bal Ti with two different microstructures, namely duplex and lamellar types. The size of colonies in fully lamellar structure also varied widely from 50 micron to 700 microns. Fracture toughness and crack growth resistance are studied under three point bend loading of SEN specimens at room temperature and at higher temperatures (700 °C and 900°C). The fracture resistance behavior for the intermetallics is studied following two methods, namely fracture toughness and crack growth resistance curves (KI vs. Δa). An appreciable improvement (around 50 percent) at 700°C is observed as compared to room temperature data. The crack size analysis is done by elastic compliance method and a normalized compliance curve (NCC) with a power law function for the aluminides is obtained irrespective of temperature. The mechanism of crack initiation as well as crack growth in different microstructures of the alloy is looked into to get an insight of the deformation and cracking process. In lamellar microstructure, colony boundaries appear to be the most preferred path for the crack growth, while multiple cracking mechanisms is observed in duplex structure.

Copyright © 2009 by ASME

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