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Cooling Behavior in a Novel Heat Sink Based on Muitilayer Staggered Honeycomb Structure

[+] Author Affiliations
Yonglu Liu

Huazhong University of Science and Technology, Wuhan; Nanchang Institute of Technology, Nanchang, China

Xiaobing Luo, Wei Liu

Huazhong University of Science and Technology, Wuhan, China

Paper No. MNHMT2009-18211, pp. 131-135; 5 pages
  • ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
  • ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3
  • Shanghai, China, December 18–21, 2009
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 978-0-7918-4391-8 | eISBN: 978-0-7918-3864-8
  • Copyright © 2009 by ASME


A novel heatsink based on a multilayer stack of thin metal plates with staggered honeycomb cells microchannels was investigated in this paper. A series of working-parametric tests such as different heat sink pipe diameter and pumping power were conducted for the microchannel cooling system to determine the heat transfer performance under small flow rate conditions. For the double fluid flow inlets and outlets heatsink design, experimental results showed that more uniform substrate temperature distribution was obtained than the single inlet and outlet ones. It showed that the heatsink design provided a good choice for electronic chips cooling applications.

Copyright © 2009 by ASME



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