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Radial, Two-Phase Heat Transport Device Driven by Electrohydrodynamic Conduction Pumping

[+] Author Affiliations
Matthew R. Pearson

United Technologies Research Center, East Hartford, CT

Jamal Seyed-Yagoobi

Illinois Institute of Technology, Chicago, IL

Paper No. IMECE2011-64799, pp. 1421-1428; 8 pages
doi:10.1115/IMECE2011-64799
From:
  • ASME 2011 International Mechanical Engineering Congress and Exposition
  • Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B
  • Denver, Colorado, USA, November 11–17, 2011
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5492-1
  • Copyright © 2011 by ASME and United Technologies Corp.

abstract

Electrohydrodynamic (EHD) conduction pumping can be readily used to pump a thin film of a dielectric liquid along a surface, using electrodes that are embedded into the surface. This effect has been demonstrated under adiabatic conditions and has also been used to create a two-phase heat transport device that is similar to a heat pipe, but with the wicking structure replaced by an EHD conduction pump. In this study, a circular two-phase heat transport device is created. The device features circular electrodes that are arranged concentrically on the bottom surface and that pump a liquid film towards a heat source located at the center of the device. This heat source evaporates the liquid, and a large annular condenser at the periphery of the bottom surface provides a continuous supply of fresh liquid. This radial pumping configuration provides several advantages. Most notably, the heat source is wetted with fresh liquid from all 360 degrees, thereby reducing the amount of distance that must be travelled compared to a linear device. Consequently, the heat flux that can be removed from the central heat source far exceeds the normal critical heat flux of the working fluid. Electrodes are embedded in the condenser, adiabatic, and evaporator sections to maximize the amount of pumping head that can be generated and thereby maximize the heat flux removal.

Copyright © 2011 by ASME and United Technologies Corp.
Topics: Heat , Heat conduction

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