0

Full Content is available to subscribers

Subscribe/Learn More  >

Modeling and Optimization of Micro-Channel Heat Sinks for the Cooling of 3D Stacked Integrated Circuits

[+] Author Affiliations
Varun Narayan, Shi-Chune Yao

Carnegie Mellon University, Pittsburgh, PA

Paper No. IMECE2011-62306, pp. 999-1011; 13 pages
doi:10.1115/IMECE2011-62306
From:
  • ASME 2011 International Mechanical Engineering Congress and Exposition
  • Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B
  • Denver, Colorado, USA, November 11–17, 2011
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5492-1
  • Copyright © 2011 by ASME

abstract

3D IC stacking offers unique opportunities to extend the number of functions per package beyond conventional chip design architectures. A critical requirement for the reliability of such high density high heat flux devices is adequate thermal management in order to ensure the junction temperatures fall within the acceptable limit. Additional constraints are related with the through silicon via (TSV) placements and compactness of the system. Liquid cooling with integrated micro-channels is a promising technology to meet these demands; however, the modeling and determining the optimal design of these channels is challenging. In this paper, a fluid-fin coupled model for heat sink temperature has been derived in explicit and easy to use form, and its feasibility for geometrical optimization has been demonstrated with a design case of 3D IC from previous literature.

Copyright © 2011 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In