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Modeling Guidelines for Large Telecom Rack CFD Models

[+] Author Affiliations
Mohammad A. Elyyan, Gokul V. Shankaran

ANSYS Inc., Austin, TX

Paper No. IMECE2011-64115, pp. 885-895; 11 pages
doi:10.1115/IMECE2011-64115
From:
  • ASME 2011 International Mechanical Engineering Congress and Exposition
  • Volume 6: Fluids and Thermal Systems; Advances for Process Industries, Parts A and B
  • Denver, Colorado, USA, November 11–17, 2011
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-5492-1
  • Copyright © 2011 by ASME

abstract

Large electronics systems such as telecom racks and VME bus systems contain arrays of several cards where fan trays consisting of multiple fans are employed to provide forced convective cooling. Typically, flow distributors such as slotted plates are used to distribute the flow evenly through the cards. Thus, a typical telecom rack system contains a large number of parts, with a wide range of length scales. Thus, modeling such large electronic systems with all components can be challenging in terms of solution time and computational resources. In this paper, we presented two techniques to create compact board models that capture the overall physical behavior of detailed boards: 1) the Lumped Block (LB) method, which is a geometry based simplification technique, 2) the Calibrated Porous Medium (CPM) method, which is based on wind tunnel calibrations. Although different in concept, both schemes showed similar behavior when compared to the detailed card, where the maximum difference from pressure drop across the board was less than 10% and less than 30% for the thermal resistance. Moreover, both schemes resulted in mesh reduction that is greater than 83%. Despite the relatively large deviation in the thermal part, both techniques provide good choices for system level analysis where general information about the flow structure and thermal behavior of the system is required.

Copyright © 2011 by ASME

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