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Numerical Modeling and Experimental Study of Hot-Embossing Process for Manufacturing of Microcomponents

[+] Author Affiliations
Jean-Philippe Marcotte, Kalonji K. Kabanemi, Jean-François Hétu

Industrial Materials Institute (IMI), Boucherville, QC, Canada

Paper No. IMECE2009-10488, pp. 117-126; 10 pages
doi:10.1115/IMECE2009-10488
From:
  • ASME 2009 International Mechanical Engineering Congress and Exposition
  • Volume 14: Processing and Engineering Applications of Novel Materials
  • Lake Buena Vista, Florida, USA, November 13–19, 2009
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4387-1 | eISBN: 978-0-7918-3863-1
  • Copyright © 2009 by National Research Council of Canada

abstract

Hot embossing is a compression molding technique used for high replication accuracy of small features. One of the most sensitive phases of the process is the de-embossing stage during which the patterned part has to be demolded. In this paper, the demolding stage is considered as a frictional contact problem between a rigid mold insert and a viscoelastic polymer sheet as it deforms and cools inside a mold under an applied force. The contact is modeled with a modified Coulomb’s law of dry friction while a generalized Maxwell model is used to describe the polymer behavior during embossing, cooling and de-embossing stages. The heat transfer between the mold insert and the patterned polymer sheet is solved through a domain decomposition method. A finite element approximation based on a penalized technique is proposed and analyzed. The purpose of this modeling approach is to predict dimensional stability and residual shape of microcomponents in the hot embossing process. Such a prediction will allow one to assign appropriate processing conditions that minimize geometrical imperfections and increase replication accuracy.

Copyright © 2009 by National Research Council of Canada

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