Full Content is available to subscribers

Subscribe/Learn More  >

Influence of Socio-Economy in the Next Generation of Thermal Management Solutions for Electronics Consumer Products

[+] Author Affiliations
Gamal Refai-Ahmed

AMD Inc., Markham, ON, Canada

Paper No. IMECE2008-69319, pp. 1631-1634; 4 pages
  • ASME 2008 International Mechanical Engineering Congress and Exposition
  • Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C
  • Boston, Massachusetts, USA, October 31–November 6, 2008
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4871-5 | eISBN: 978-0-7918-3840-2
  • Copyright © 2008 by ASME


The past few decades have seen a number of countries around the world emerge as a growing market for high performance computers. This present study examines, in more detail, how socio-economic influences are shaping the demand function and how some computing landscapes are changing as a consequence. This study is addressing one of the key initiatives to enable 50 percent of the world’s population with access to the World Wide Web. Furthermore, this investigation is addressing the challenges for electronics packaging Engineers and Researchers. Therefore, the rational of the developed technology based on the understanding target market and usages will be given. The impact of addressing the heat dissipation and managing the use of the raw materials of the intended products are discussed. In addition, how the electronics packaging engineers can focus on developing affordable innovative technology. Finally, the impact of all of the above is examined in developing the cost effective solution from a global point of view.

Copyright © 2008 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In