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Influence of Socio-Economy in the Next Generation of Thermal Management Solutions for Electronics Consumer Products

[+] Author Affiliations
Gamal Refai-Ahmed

AMD Inc., Markham, ON, Canada

Paper No. IMECE2008-69319, pp. 1631-1634; 4 pages
doi:10.1115/IMECE2008-69319
From:
  • ASME 2008 International Mechanical Engineering Congress and Exposition
  • Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C
  • Boston, Massachusetts, USA, October 31–November 6, 2008
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4871-5 | eISBN: 978-0-7918-3840-2
  • Copyright © 2008 by ASME

abstract

The past few decades have seen a number of countries around the world emerge as a growing market for high performance computers. This present study examines, in more detail, how socio-economic influences are shaping the demand function and how some computing landscapes are changing as a consequence. This study is addressing one of the key initiatives to enable 50 percent of the world’s population with access to the World Wide Web. Furthermore, this investigation is addressing the challenges for electronics packaging Engineers and Researchers. Therefore, the rational of the developed technology based on the understanding target market and usages will be given. The impact of addressing the heat dissipation and managing the use of the raw materials of the intended products are discussed. In addition, how the electronics packaging engineers can focus on developing affordable innovative technology. Finally, the impact of all of the above is examined in developing the cost effective solution from a global point of view.

Copyright © 2008 by ASME

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