Full Content is available to subscribers

Subscribe/Learn More  >

Integral Micro-Channel Packages for Enhanced Thermal Performance

[+] Author Affiliations
Stephen A. Solovitz, Thomas E. Conder

Washington State University - Vancouver, Vancouver, WA

Paper No. IMECE2008-66423, pp. 1487-1496; 10 pages
  • ASME 2008 International Mechanical Engineering Congress and Exposition
  • Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C
  • Boston, Massachusetts, USA, October 31–November 6, 2008
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4871-5 | eISBN: 978-0-7918-3840-2
  • Copyright © 2008 by ASME


Modern advancements in transistor technology have pushed thermal dissipations from power electronics near the edge of the capability of single-phase micro-channel designs. To alleviate this problem, researchers have begun investigating enhancements to these designs, using methods such as pin fins, turbulators, and impinging jets. These techniques can potentially enhance the convective thermal performance by a factor of 2 to 3, although they do incur a similar magnitude pressure penalty. However, because of the requirements of electrical isolation and mechanical assembly, much of this benefit is tempered, as the convective thermal resistance is only a small fraction of the total resistance. This limitation can be removed through the use of an integral package design where the heat sink passages are fashioned in the electrical stack, which can reduce the conductive resistance until convective enhancements are significant again. These methods include fabrication of micro-channels directly into the active metal braze substrate and potentially even the electrical insulation layer. Thus, while a traditional, non-integral design only experiences a 5% overall benefit when the convective resistance is reduced by 50%, an integral package can have a 20 to 30% improvement for the same enhancement. To examine this capability, a series of computational fluid dynamics studies were conducted to study the performance of several integral micro-channel heat sink configurations. These simulations determined the response for a range of coolants, flowrates, device power dissipations, and operating conditions. These results will serve as a baseline for further development of enhanced, integral micro-channel designs.

Copyright © 2008 by ASME
Topics: Microchannels



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In