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Interfacial Thermal Resistance in Nanoscale Heat Transfer

[+] Author Affiliations
Ganesh Balasubramanian, Soumik Banerjee, Ishwar K. Puri

Virginia Polytechnic Institute and State University, Blacksburg, VA

Paper No. IMECE2008-69152, pp. 969-973; 5 pages
doi:10.1115/IMECE2008-69152
From:
  • ASME 2008 International Mechanical Engineering Congress and Exposition
  • Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C
  • Boston, Massachusetts, USA, October 31–November 6, 2008
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4871-5 | eISBN: 978-0-7918-3840-2
  • Copyright © 2008 by ASME

abstract

We investigate nanoscale thermal transport across a solid-fluid interface using molecular dynamics simulations. Cooler fluid argon (Ar) is placed between two heated iron (Fe) walls, thereby imposing a temperature gradient within the system. Fluid-fluid and solid-fluid interactions are modeled with Lennard-Jones potential parameters, while Embedded Atom Method (EAM) is used to describe the interactions between solid molecules. The Fe-Ar interaction causes ordering of fluid molecules into quasi-crystalline layers near the walls. This causes temperature discontinuity between these solid-like Ar molecules and the adjacent fluid. The time evolution of the interfacial (Kapitza) thermal resistance (Rk ) and Kapitza length (Lk ) are observed. The averaged Kapitza resistance (Rk,av ) varies with the initial temperature difference between the wall and the fluid (ΔTw ) as Rk,av ∝ ΔTw−0.82.

Copyright © 2008 by ASME

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