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Development of an R245fa for Electronics Cooling System for High Heat Flux Applications

[+] Author Affiliations
Farhad Saffaraval, Amir Jokar

Washington State University Vancouver, Vancouver, WA

Paper No. IMECE2009-12076, pp. 1741-1747; 7 pages
doi:10.1115/IMECE2009-12076
From:
  • ASME 2009 International Mechanical Engineering Congress and Exposition
  • Volume 9: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B and C
  • Lake Buena Vista, Florida, USA, November 13–19, 2009
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4382-6 | eISBN: 978-0-7918-3863-1
  • Copyright © 2009 by ASME

abstract

The objective of this study is to experimentally explore thermodynamic performance of R245fa, as a low-pressure and environmentally-friendly refrigerant, in a microchannel heat exchanger. This heat exchanger is used in an electronics cooling application with high-power density. Due to the large amount of latent heat that is released during evaporation process, the two-phase microchannel coolers are able to remove much more energy compared to single-phase cooling systems. In this study, R245fa is used as the working fluid in a refrigeration pump loop that mainly includes an evaporator, a condenser, a refrigerant pump, and a pressure regulator valve. The goal is to obtain optimal mass flow rates and system pressures while the temperatures in evaporator and condenser are kept constant for specific conditions. The results obtained from this study are then compared to the results previously obtained for water as the working fluid in a similar cooling system. It is expected the evaporative cooling through the microchannel heat exchanger be a viable and effective solution, especially for higher heat flux applications.

Copyright © 2009 by ASME

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