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Experiment, Thermal Simulation and Characterizations on Transmission Laser Coating of Hydroxyapatite on Metal Implant

[+] Author Affiliations
Gary J. Cheng, Chang Ye

Purdue University, West Lafayette, IN

Paper No. MSEC_ICMP2008-72290, pp. 535-542; 8 pages
  • ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing
  • ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2
  • Evanston, Illinois, USA, October 7–10, 2008
  • Conference Sponsors: Manufacturing Engineering Division
  • ISBN: 978-0-7918-4852-4 | eISBN: 978-0-7918-3836-6
  • Copyright © 2008 by ASME


Coating of bioceramic material — Hydroxyapatite (HAp) — on metal implant has attracted many attentions in biomedical industry recently because its combination of good mechanical property and biocompatibility. However, most of current HAp coatings are lack of coating/substrate interfacial strength, and/or biocompatibility. The cell-tissue attachment is affected by the degraded biocompatibility due to decomposition of HAp during high temperature processing. In this paper, an innovative method — transmission laser coating is investigated to coat HAp on Ti substrate with low temperature processing. This process enhances the HAp/Metal interfacial property of current coatings, while maintaining good biocompatibility. Experiments are conducted using a continuous Nd-YAG laser. Multiphysics simulation is conducted to simulate the temperature distribution in coatings and substrates during TLC processing. X-ray energy dispersion spectrum is used to measure the chemical composition of HAp coatings after TLC process. Pull-out tests are conducted to measure the interfacial strength between the HAp coating and Ti substrate. Cell culture study is conducted to qualitatively evaluate the biocompatibility after TLC of HAp particles. These results show that TLC processing will open new ways of producing biocompatible bioceramic coatings with controlled thickness, and at low processing temperature.

Copyright © 2008 by ASME



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