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Dynamic Mold Temperature Control Using Gas-Assisted Heating and Its Effect on the Molding Replication Qualities of Micro Channels

[+] Author Affiliations
Shia-Chung Chen, Yaw-Jen Chang, Jen-An Chang, Hsin-Shu Peng, Ying-Chieh Wang

Chung Yuan Christian University, Chung-Li, Taiwan, R.O.C.

Paper No. MSEC_ICMP2008-72458, pp. 411-415; 5 pages
  • ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing
  • ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2
  • Evanston, Illinois, USA, October 7–10, 2008
  • Conference Sponsors: Manufacturing Engineering Division
  • ISBN: 978-0-7918-4852-4 | eISBN: 978-0-7918-3836-6
  • Copyright © 2008 by ASME


Dynamic mold surface temperature control (DMTC) has the advantage of improving molded part qualities without significant increases in cycle time. A gas-assisted heating system combined with water cooling was developed to achieve DMTC for injection molding. With gas-assisted heating, it takes 2s for the mold surface temperature to vary from 60 °C to 120 °C whereas it requires 186s using water heating. Further, it takes 21s and 84s for the mold surface to cool to 60 °C under gas heating and water heating, respectively. The gas-assisted heating system also shows excellent efficiency for micro injection molding of biochips to achieve high replication accuracy of the micro channels.

Copyright © 2008 by ASME



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