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Micromachining of Metals, Alloys and Ceramics by Picosecond Laser Ablation

[+] Author Affiliations
Wenqian Hu, Galen B. King, Yung C. Shin

Purdue University, West Lafayette, IN

Paper No. MSEC_ICMP2008-72247, pp. 321-328; 8 pages
doi:10.1115/MSEC_ICMP2008-72247
From:
  • ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing
  • ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2
  • Evanston, Illinois, USA, October 7–10, 2008
  • Conference Sponsors: Manufacturing Engineering Division
  • ISBN: 978-0-7918-4852-4 | eISBN: 978-0-7918-3836-6
  • Copyright © 2008 by ASME

abstract

Microhole drilling and microstructure machining with a picosecond (ps) Nd:YVO4 laser (pulse duration of 10 ps) in metals, alloys and ceramics are reported. Blind and through microholes were drilled by percussion drilling as well as trepanning drilling. The diameters of the holes were in the range from 20 μm to 1000 μm. Microfeatures were machined and the flexibility of ps laser machining was demonstrated. The quality of drilled holes, e.g., recast layer, microcrack and conicity, and that of the microstructures, were investigated by optical microscope, surface profilometer, or scanning electron microscope (SEM). Ps laser ablation rate was investigated by experiments as well as a simplified laser ablation model.

Copyright © 2008 by ASME

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