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Viscoplastic Model Verification for SnPb Solder Based on Creep Tests

[+] Author Affiliations
Changwoon Han, Noh-Chang Park, Chul-Min Oh, Won-Sik Hong, Byeongsuk Song

Korea Electronics Technology Institute, Seongnam, South Korea

Paper No. IMECE2009-11129, pp. 171-172; 2 pages
doi:10.1115/IMECE2009-11129
From:
  • ASME 2009 International Mechanical Engineering Congress and Exposition
  • Volume 5: Electronics and Photonics
  • Lake Buena Vista, Florida, USA, November 13–19, 2009
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4378-9 | eISBN: 978-0-7918-3863-1
  • Copyright © 2009 by ASME

abstract

Heat sink assembly for a main board in a server station is built on printed circuit board by an anchor system, mounted by eutectic SnPb solder. Constant high temperature condition in the station keeps solder creeping and makes it failed eventually. To calculate the stress and predict the life of soldered anchor in the station, an FE model of anchor system is built. As viscoplastic behavior of solder depends on several factors such as microstructure of solder, temperature, load, and loading rate, model characteristics should be verified before applying it to life prediction. In this study, Anand unified constitutive equation is adapted for solder modeling and its creep behavior is calibrated and verified based on creep tests.

Copyright © 2009 by ASME
Topics: Creep , Solders

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