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Indentation Size Effect on the Hardness of a Sn-Ag-Cu Solder

[+] Author Affiliations
Y. D. Han

Tianjin University, Tianjin, China; Nanyang Technological University, Singapore

H. Y. Jing, L. Y. Xu

Tianjin University, Tianjin, China

S. M. L. Nai, J. Wei

Singapore Institute of Manufacturing Technology, Singapore

C. M. Tan

Nanyang Technological University, Singapore

Paper No. IMECE2009-10551, pp. 137-141; 5 pages
doi:10.1115/IMECE2009-10551
From:
  • ASME 2009 International Mechanical Engineering Congress and Exposition
  • Volume 5: Electronics and Photonics
  • Lake Buena Vista, Florida, USA, November 13–19, 2009
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4378-9 | eISBN: 978-0-7918-3863-1
  • Copyright © 2009 by ASME

abstract

In the present study, nanoindentation studies of the 95.8Sn-3.5Ag-0.7Cu lead-free solder were conducted over a range of maximum loads from 20mN to 100mN, under a constant ramp rate of 0.05s−1 . The indentation scale dependence of hardness was investigated. The results revealed that the hardness is dependent on the indentation depth. As the maximum holding load increased, which corresponded to an increasing indentation depth, a decreasing trend in the hardness was observed.

Copyright © 2009 by ASME

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